| Quality Control and CT | |
|---|---|
| By David Moller-Gunderson Quality control on the production lines is always a concern. A simple process error in one section of a line can cause the entire output of the line to fail, which can ultimately lead to scrapping an entire run of product or, in the worst case, a very costly recall. In order to prevent this situation, standard practice is to test a sample set of each run to ensure that product quality is where it needs to be. X-ray inspection provides an alternative to destructive testing that not only leaves the product intact but is also significantly faster. Advances in both 2D and 3D X-ray inspection give results that are as good as, and in many cases far superior to, standard destructive testing methods. This article was written and first published in USTech, May 2007. | Download (18 kb) |
| What you can´t see can hurt you | |
| By Robert Maziuk and
Holger Roth 3D X-ray inspection by means of computed tomography is becoming more and more important especially for complex and safety relevant objects. The article shows opportunities for failure analysis with microfocus CT. It was published in "Quality Magazine", March 2003 issue. | Download (133 kb) |
| The X-ray Times, Vol. 1 | |
| Information about phoenix|x-ray and several technical feature stories. | Download (143 kb) |
| More than counting black dots | |
| By Holger
Roth Microfocus X-ray inspection has become a generally accepted method to control the quality of board assemblies, and to analyse defects of hidden solder joints. And it is key to sufficient implementation and monitoring of the reflow process for BGA, CSP and flip-chip. For optimum exploitation, the right equipment should be operated in an appropriate way, and result be interpreted in ligth of the assembly process. This article appeared in the 1/2 2002 issue of EPP and EPP Europe magazines´ special on AOI and AXI. For further information visit www.epp-online.de | Download (317 kb) |
| Analysis and Automated Offline-Inspection of BGA, FBGA and CSP Solder Joints with no Set-up Time | |
| by Holger Roth The applications for BGA, FBGA, CSP and FlipChip interconnection techniques are expanding into broader fields of application. Since these substrate-based solder joints are scarcely accessible to other optical inspection methods, the use of non-destructive X-ray inspection is consequently on the rise. This article appeared in the 4th quarter issue of Printed Circuit Europe magazine, the leading publication for the pan-European PCB and assembly industries. For further information visit www.pcemagazine.com | Download (504 kb) |
| 2D or 3D - choosing with today's technology | |
| by Holger
Roth Until very recently, costly 3-D Systems were needed to find numerous subtle defects. Today, new 2-D systems with ovhm offer an inexpensive alternative in many instances. (SMT, May 2001) | Download (804 kb) |