microme|x
The microme|x is a high-resolution submicron X-ray system for the inspection of solder joints and electronic components.
Possible applications include:
Special features:
- Max. inspection area of 24“ x 22“
- Detail detectability of <1µ
- Max. tube voltage of 180 kV / 20W
- Automated voiding calculation for multi-chip modules
- Real-time detector resolution of 2 megapixel
- 24" TFT display
- Max. magnification up to 23.320x
- Automated X-ray inspection of BGAs, CSPs, QFPs, QFNs, PTHs, Voiding Calculation, Wire Sweep
- Low-maintenance, long-life (open) submicron X-ray tube
- Ergonomically designed control panel
- Steplessly adjustable projection angle up to 70°, rotation 0°-360°
- optional with CT upgrade available
- Easy-view-configuration: The X-ray image shows the object exactly as the operator sees it through the radiation protection window.
For more information on this particular X-ray inspection system, please contact us, we will be more than glad to answer your question!
| microme|x α | microme|x λ |
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| The microme|x α is a high-resolution, automated X-ray inspection system for inspecting electronic components; also available with automated component feeding.
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| The microme|x λ is a high-resolution, automated X-ray inspection system for inspecting large electronic components.
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