On the occasion of Control 2006 in Sinsheim, phoenix|x-ray presents the new X-ray inspection system microme|x to the public for the first time. These submicron-high resolution system is an optimal and efficient solution for the manual and automatic solder joint inspection. The automatic X-ray inspection of e.g. BGA, CSP, MLF and QFP is made by a highly precise manipulation.
The
microme|x disposes of a integrated 2 Megapixels camera and surpasses the
existent standard of 1,3 Megapixels. Combined with the open 160kV or 180kV
submicron X-ray tube, a detail detectability of <1µm as well as a total
magnification of up to 13.300x can be reached.
The microme|x possesses a
high precise manipulation with 360° rotation axis and the approved technology
for oblique views up to 70°. The scanning area has a size of 18”x14”. Because of
that, samples with a size of max. 680mm x 635mm and a weight of up to 5kg, can
be inspected without problems.
The new inspection software
quality|assurance 2006, which were especially programmed for the user’s
requirements, offers an easy using and a many-sided fully digital image
processing. In addition the extreme powerful algorithm toolbox XE² offers the
best solution for application testing.