At the SMT/Hybrid/Packaging show in Nuremberg phoenix|x-ray Systems + Services launched new powerful plug-in software modules for the automatic inspection of concealed solder joint features.
Similar to the proven and now updated bga|module, the new qfp|module coveres all inspection criteria as mentioned in the commonly applied standard IPC-A-610C: The software detects and evaluates all decisive features of QFP type solder joints (flat ribbon, L, gull wing leads) including:
quality of heel fillet
In view of the increasing use of micro lead frame devices (MLF), phoenix|x-ray offers the mlf|module which can be adapted to the various land-lead configurations of this type of SMD.
For non-typical interconnections appropriate plug-in modules can be quickly customised with XE2 (X-ray image Evaluation Environment), a powerful software package for the development of image evaluation procedures.
The detected defects are recorded and defect images are stored. The results may be visualised by the novel quality|review software which is the perfect link to rework, displaying the defect in the original X-ray image together with its classification from the inspection record and indicating the position of the defect in an X-ray map of the sample. The software offers easy data management and sample identification by its serial number.