Wunstorf, Germany, 2001-03-19. The X-ray inspection of non-conductive die-attach has been not feasible using the customary real time image technique. This has changed now with the launch of the new high-contrast|detector by phoenix|x-ray.
At the first seminar on non-conductive die-attach inspection in Seoul / Korea the high-contrast|detector was demonstrated in a phoenix|x-ray inspection system. Mr. D. H. Yoon, sales director of Ahtech, and Mr. T. Mayer, phoenix|x-ray application manager for Asia, presented the latest results which were found to be a break-through in non-conductive die-attach inspection. The seminar was attended by representatives of the four biggest semiconductor companies in Korea.
The high-contrast|detector also provides unprecedented results inspecting other low absorbing ob-jects or features of poor X-ray contrast. Some typical applications are prepreg voids, microvias, moulding voids and biological specimen. The device can be optionally integrated into each phoenix|x-ray system of the analyser series and into the package|inspector, even as a supplement to existing installations.
The capabilities of the high-contrast|detector can be demonstrated at the Semicon in Munich, Ger-many, (April, 24-26) or at the phoenix|x-ray facilities in Wunstorf.
Figure caption:
high-contrast|detector image of an electronic package showing clearly the voids in the non-conductive die-attach (bright spots).