On September 4th the 1. X-ray Forum was successfully conducted at the phoenix|x-ray headquarters in Wunstorf. More than 50 visitors attended the symposion and showed their interest for the varied programme of different talks and demonstrations on microfocus X-ray inspection.
In the first contribution Dr. Thomas Ahrens, Fraunhofer Institute Silicon Technology, Itzehoe, discussed the advantages and disadvantages of X-ray inspection of electronic devices in comparison to conventional optical inspection.
Prof. Dr. Klaus-Juergen Wolter, Dresden Technical University, in his talk on "The future of interconnection technology" gave a detailed overview about the recent and prospective interconnection developments. Stating that the tendency towards miniaturisation was going to continue in the coming years, Prof. Wolter pointed out that production managers were still having to face many challenges towards production processes and that due to this fact non destructive testing systems with a high resolution were going to be even more important in the future.
Dr. Holger Roth from phoenix|x-ray focussed on the new developments in X-ray inspection technology. First he explained the features of the ovhm|module (oblique view at highest magnification) which improves the failure detection of e.g. BGA solder joints. The presentation of the high-contrast|set contained comparative images of features with low contrast which can be made visible with this new image detector (e.g. visualisation of voids in non-conductive die-attach). The latest invention Mr. Roth introduced to the attendants was the open nanofocus X-ray tube with a detail-detectability of less than 0.5 microns (500 nanometers). The high resolution offers a completely new view on smallest features such as bond wire cracks and similar which could not be detected in the past.