Stuttgart, Germany, 2000-02-29. The partnership between microtec and phoenix|x-ray concluded with effect from November 4, 1999, considerably widens the potential for non-destructive testing of electronic components and assemblies at microtec. Phoenix|x-ray now has established its southern German base at microtec. In addition to the performance of X-ray tests in the µm range using the very latest in X-ray machinery, an ideal know-how concentration in analysis is also achieved. As a result, the analysis methods of microtec optimally complement the X-ray expertise of phoenix|x-ray. The core service of the Stuttgart company microtec GmbH, a subsidiary of the SICAN Group of Companies, Hannover, since 1997, is the testing of wafers and ICs on behalf of semiconductor manufacturers and users, plus the development of test hardware and software. Other backend services such as straightening of bent pins (Scanning / Straightening), burn-in and tape packaging (Tape & Reel) have since been added with considerable success. These services have made microtec one of the biggest testing companies in Europe. Qualification and failure analysis services for microelectronic components have been expanded since 1996 by the steadily growing field of equipment failure analysis. In providing this service, microtec charted a course that was unconventional for a testing company like this, i.e. dealing with electronic assemblies, equipment and systems. This course was taken in response to the fact that in the final analysis it is more and more the chips that are fulfilling the central function of an electronic system. This makes the manufacturers increasingly reliant on the semiconductor know-how and experience that microtec can offer. An important factor in this is failure analysis, where it is of great importance to find out how things look inside the equipment or the assembly before it is opened. This is the only way to detect error sources that might no longer be verifiable after opening - and this is where the microfocus X-ray test is the ideal option. This test has however also been used successfully for solder testing, for example, particularly in inaccessible areas such as BGAs, and in the event of cracking in PCBs or in cable connectors. For the qualification of high-grade and highly dependable components for aerospace applications, X-ray testing has long been a standard procedure. microtec and phoenix|x-ray expect from this partnership a high degree of acceptance from both existing and new customers. The medium-term objective is the setup in southern Germany of a Center of Competence for technical X-ray diagnostics that both provides services and distributes X-ray systems from phoenix|x-ray. (Walter Schock, Dipl.-Ing. (FH))