| bench|mate | microme|x | nanome|x | pcba|inspector | |
|---|---|---|---|---|
 |  |  |  | |
| 3D computed tomography | no | yes (optional) | yes (optional) | no |
| max. inspection area | 6” x 6” | 24” x 22” | 24” x 22” | 24“ x 18“ |
| real-time detector resolution | 848 x 480Pixel | 2 MPixel and 24" monitor | 2 MPixel (optional 4 MPixel) and 24" monitor | 848 x 480 Pixel |
| detail detectability | <2µ | <1µ | <0,3µ (300nm) | <2µ |
| max. magnification | up to 50x | up to 23.320x | up to 25.000x | up to 460x |
| automated X-ray inspection | Voiding Calculation, BGA | BGA, CSP, QFP, QFN, PTH, Voiding Calculation, Wire Sweep | BGA, CSP, QFP, QFN, PTH, Voiding Calulation, Wire Sweep | BGA, Voiding Calculation |
| max. tube voltage | 100kV | 180kV | 180kV | 130kV |
For application examples, please go to Semiconductors and other electronic components.