Electronic components are becoming increasingly miniature. Only highest-resolution X-ray technology provides the means necessary to inspect such components. Typical inspection tasks include:
 | nanofocus X-ray image of a broken bond wire inside an IC- case. |
 | Die attach voids on the backside of a semiconductor inside an IC-case. Void size and distribution are determined fully automatically. |
 | High- magnification nanofocus X-ray image of a ball bond inside a light-emitting diode. The gold wire is 25 µm wide. |
 | nanofocus X-ray image of flip- chip solder joints inside a processor case. The image shows one solder bridge and several open solder joints. The solder joint diameter is app. 150 µm. |
 | nanoCT® of a SMD-inductor, size 0805 (2.0 mm x 1.2 mm). The 3D X-ray image shows the interior coil behind the end cap. In any conventional radiograph, the layers would be overlapping, but the nanoCT® succeeds in displaying the object layer by layer. |