High-resolution X-ray technology is widely used in failure analysis and production quality testing of electronic devices. Any material flaw and quality characteristic affecting the shape of solder joints can be detected:
The fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage and repeatability.
A nanoCT® provides even more information.
 | x|act offers live overlay of CAD-data in the live X-ray image. Information about the solder joint, e.g. pad numbering, related package or inspection results is available at any time. Visible in the X-ray image is missing heel fillet and complete missing solder at two gullwing solder joints. Cause of error: Poor solder paste pressure. |
 | Microfocus X-ray image of BGA solder joints in vertical top-down view: Four solder joints are connected by solder bridges. The solder penetrated a through-hole plating. Cause of error: Defective masking laquer. |
 | Microfocus X-ray image of BGA solder joints in oblique view at a detector angle of 55°: Two open solder joints are present; the soldering paste melted and wetted the pads, but did not form a junction with the solder balls. Cause of error: poor solder surface, oxide film. |
 | nanoCT® of two neighboured BGA solder joints. The solder joint at the
left is open: The soldering paste melted and wetted the pads, but did
not form a junction with the solder balls. The lighter areas are
different metallic phases.
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 | nanoCT® of a µBGA after 4000 temperature stress cycles. Due to a voxelsize of 0.5 microns, cracks with 8 to < 1 micron are detectable. |
 | Microfocus X-ray image QFN solder joints in oblique view at a detector angle of 45°: Two landings of two solder joints are not wetted. Cause of error: Poor solder paste pressure. |
 | Microfocus X-ray image of through-hole solder joints in oblique view at a detector angle of 50 °: The through-hole plating in the center is not properly soldered. The solder has wetted the pin, but not the plating wall. Cause of error: Poor wall metallization. |