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PCBAs

Printed Board Assembly

High-resolution X-ray technology is widely used in failure analysis and production quality testing of electronic devices. Any material flaw and quality characteristic affecting the shape of solder joints can be detected:


A nanoCT®- provides even more information.

For a basic feature comparison for the X-ray systems we recommend for these applications, please go to product recommendation.

Microfocus X-ray image of  BGA solder joints in vertical top-down view:

Four solder joints are connected by solder bridges. The solder penetrated a through-hole plating. Cause of error: Defective masking laquer.

Microfocus X-ray image of BGA solder joints in oblique view at a detector angle of 55°:

Two open solder joints are present; the soldering paste melted and wetted the pads, but did not form a junction with the solder balls. Cause of error: poor solder surface, oxide film.

nanoCT® of two neighboured BGA solder joints. The solder joint at the left is open: The soldering paste melted and wetted the pads, but did not form a junction with the solder balls. The lighter areas are different metallic phases.


Microfocus X-ray image of gull-wing solder joints in oblique view at a detector angle of 15°:

Two solder joints are missing heel fillet and, on the backside of the component, two pads are connected by a solder bridge. Cause of error: Poor solder paste pressure.

Microfocus X-ray image of through-hole solder joints in oblique view at a detector angle of 50 °:

The through-hole plating in the center is not properly soldered. The solder has wetted the pin, but not the plating wall. Cause of error: Poor wall metallization.

For a basic feature comparison for the X-ray systems we recommend for these applications, please go to product recommendation.