High-resolution X-ray technology is widely used in failure analysis and production quality testing of electronic devices. Any material flaw and quality characteristic affecting the shape of solder joints can be detected:
A nanoCT®- provides even more information.
 | Microfocus X-ray image of BGA solder joints in vertical top-down view: Four solder joints are connected by solder bridges. The solder penetrated a through-hole plating. Cause of error: Defective masking laquer. |
 | Microfocus X-ray image of BGA solder joints in oblique view at a detector angle of 55°: Two open solder joints are present; the soldering paste melted and wetted the pads, but did not form a junction with the solder balls. Cause of error: poor solder surface, oxide film. |
 | nanoCT® of two neighboured BGA solder joints. The solder joint at the
left is open: The soldering paste melted and wetted the pads, but did
not form a junction with the solder balls. The lighter areas are
different metallic phases.
|
 | Microfocus X-ray image of gull-wing solder joints in oblique view at a detector angle of 15°: Two solder joints are missing heel fillet and, on the backside of the component, two pads are connected by a solder bridge. Cause of error: Poor solder paste pressure. |
 | Microfocus X-ray image of through-hole solder joints in oblique view at a detector angle of 50 °: The through-hole plating in the center is not properly soldered. The solder has wetted the pin, but not the plating wall. Cause of error: Poor wall metallization. |