Electronic devicesnanoCT® showing solder joints of a CSP-component. The three-dimensional shape of the solder joints, app. 400 µm in diameter, and void distribution are clearly visible. Inside the solder joints, different eutectic solder phases are visible. For more examples, please go to printed board assembly. | |
Electronic componentsnanoCT® of a high-performance light-emitting diode showing how the bond wires, 25 µm in width, are aligned and the shape of the bonding area. For more examples, please go to Semiconductors and other electronic components. | |
CastingCT-image of a cast-aluminum piston showing the hidden contours and inside surfaces of the object under inspection including some voids, the size and position of which can be calculated automatically. The tomographic image is the basis for three-dimensional measurement (Surface reconstruction and normative-actual value comparison). | |
Materials sciencenanoCT® of an object made of glass fiber-reinforced plastic: Alignment and distribution of the glass fibers as well as agglomerations of mineral filler (purple) are visible. The fibers are app. 10 µm wide. For more examples, please go to Materials Science. | |
Sensor technologyMicrofocus-CT showing a lambda probe: the weld seams of the case, crimp connections, the geometric alignment of the probe, and the condition of the ceramic sensor. For more examples, please go to Sensorics and Electrical Engineering. |